Prime Minister Shri Narendra Modi participates in the groundbreaking ceremony of HCL-Foxconn Semiconductor Unit in Uttar Pradesh via Video Conferencing

• Joint venture (JV) between HCL (India) and Foxconn (Taiwan) to set up a semiconductor display-driver chip plant at Jewar (YEIDA), Uttar Pradesh, under the India Semiconductor Mission (ISM).
• Project vehicle: India Chip Pvt. Ltd. / "India Chip Limited"; classified as an OSAT/display-fab facility approved under the Modified Semicon India Programme.
• Sixth semiconductor unit cleared under ISM; PM laid the foundation on 21 February 2026 via video conferencing.
• Relevance: Tests aspirants on Atmanirbhar Bharat in electronics, PLI/Semicon India, and India's tech-strategic autonomy in chip supply chains.