Groundbreaking of India’s First Advanced 3D Semiconductor Packaging Unit in Odisha; Major Boost to AI, 5G and Defence Tech

• Foundation stone of India's first advanced 3D chip packaging unit laid at Info Valley, Bhubaneswar (Odisha) on 19 April 2026 by 3D Glass Solutions Inc. (3DGS, USA) under the India Semiconductor Mission (ISM).
• Project introduces Heterogeneous Integration Packaging Solutions using embedded glass substrates, a frontier packaging technology critical for AI, 5G, and Defence chips.
• Marks Odisha as the first Indian state to host both a compound-semiconductor fab and a 3D glass-substrate packaging unit.