MoU signed to bring substrate manufacturing technology to India; Govt. of Odisha, Intel and 3DGS parties to the agreement

• Tripartite MoU between Govt. of Odisha, Intel Corp. and 3D Glass Solutions Inc. (3DGS, USA) to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in Odisha.
• One of India's largest high-technology manufacturing investments under the India Semiconductor Mission (ISM).
• Relevance: deepens India's semiconductor value chain (moving from ATMP/OSAT into substrates — a critical upstream gap), strategic autonomy in chipmaking, Centre–State industrial federalism.