·PIB·15 marks·250–350 words

Evaluate the role of production-linked and design-linked incentive schemes in fostering high-tech manufacturing in India.

In this answer
  1. Merits demonstrated
  2. Limitations

Outcome-linked incentives mark a shift from protecting domestic industry through tariffs to subsidising verifiable capacity creation. The India Semiconductor Mission (ISM) is the clearest test case: ISM 1.0's ₹76,000 crore corpus has been succeeded by ISM 2.0 with an outlay of ₹1,27,500 crore [1]. They have delivered real entry, but not yet technological depth.

Merits demonstrated

  • Investment mobilisation: twelve manufacturing units approved with cumulative investment of over ₹1.64 lakh crore, including a silicon fab, a silicon carbide fab and nine packaging units [1].
  • Visible production milestones: units such as Micron, Kaynes and CG Semi have entered commercial production, with the first 'Made-in-India' chips presented to the Prime Minister from the Sanand facility [2][3].
  • Design ecosystem seeding: the Design-Linked Incentive has supported over 100 startups developing chips, a low-cost lever suited to India's existing talent pool [1].
  • Strategic hedging: domestic capacity reduces exposure of defence, telecom and automotive supply chains to a geographically concentrated foundry base [4].

Limitations

  • Value-chain skew: approvals cluster in assembly, testing and packaging — capital-light and easily replicated — while the wafer itself remains imported, so import dependence falls less than headline investment implies [2].
  • Budgetary realism: ISM 2.0 carries only ₹1,000 crore in FY2026-27 against its headline outlay [1]; milestone-linked disbursement, not sanction size, is the binding constraint.
  • A crowded subsidy race: Japan and Korea already match or exceed India's 50% support, and grants rose sharply from 2023 worldwide, raising legacy-node overcapacity risk and eroding India's locational edge [5].
  • Design under-funded: ₹1,000 crore for DLI against ₹65,000 crore for fabs under ISM 1.0 arguably inverts India's comparative advantage [1][4].

On balance, these schemes have successfully created an entry point where none existed, and must be judged as a strategic insurance premium rather than a short-run efficiency gain. Rebalancing toward design, publishing unit-wise disbursement and utilisation data, and embedding state-level power and water commitments would convert this opening into durable capability — the substance of Atmanirbhar Bharat.

Sources

  1. 1India Semiconductor Mission 2.0, PIBISM 1.0/2.0 outlays, approved units and investment, DLI startups, FY2026-27 allocation
  2. 2India Semiconductor Mission — approvals and production status, PIBunits in commercial production; packaging-led project mix
  3. 3First set of Made-in-India chips presented to the Prime Minister, PIBSanand pilot line milestone
  4. 4From Fabless to Fabs Everywhere? Global Value Chain Development Report 2023, Ch. 4, WTOfoundry concentration and the fabless-versus-fab trade-off
  5. 5Recent Trends in Semiconductor Subsidies, OECD (April 2025)global rise in fab grants since 2023 and competing incentive packages

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