UPSC Prelims Practice Questions — ‘Govt.’s semiconductor mission will promote research’
Q1. The India Semiconductor Mission (ISM) has been set up and operationalised as an independent business division, with administrative and financial autonomy, within which one of the following organisations?
- A. Digital India Corporation
- B. Centre for Development of Advanced Computing (C-DAC)
- C. NITI Aayog's Frontier Tech Hub
- D. Software Technology Parks of India (STPI)
Q2. With reference to the India Semiconductor Mission (ISM), consider the following:
1. Scheme for setting up of Semiconductor Fabs
2. Scheme for setting up of Display Fabs
3. Design Linked Incentive (DLI) Scheme
4. Production Linked Incentive (PLI) Scheme for IT Hardware
Which of the above is/are correctly identified as constituent schemes operated exclusively under the ISM?
- Scheme for setting up of Semiconductor Fabs
- Scheme for setting up of Display Fabs
- Design Linked Incentive (DLI) Scheme
- Production Linked Incentive (PLI) Scheme for IT Hardware
- A. 1 and 2 only
- B. 1, 2 and 3
- C. 3 and 4 only
- D. 1, 2, 3 and 4
Q3. Which one of the following is the nodal/implementing agency for the Design Linked Incentive (DLI) Scheme under the Semicon India Programme?
- A. Centre for Development of Advanced Computing (C-DAC)
- B. Digital India Corporation
- C. Semiconductor Complex Limited (SCL), Mohali
- D. Electronics Corporation of India Limited (ECIL)
Q4. The Design Linked Incentive (DLI) Scheme aims to nurture at least how many domestic semiconductor design companies to help them achieve an annual turnover of more than ₹1,500 crore over a five-year period?
Q5. India Semiconductor Mission 2.0, announced in the Union Budget 2026-27, is implemented under the administrative charge of which one of the following ministries?
- A. Ministry of Electronics and Information Technology (MeitY)
- B. Ministry of Heavy Industries
- C. Ministry of Science and Technology
- D. Ministry of Commerce and Industry
Q6. ISM 2.0 is described as a decisive shift from ISM 1.0's design-fab-packaging focus. Which one of the following is projected as the flagship new manufacturing thrust added under ISM 2.0?
- A. Manufacturing of semiconductor equipment and materials within India
- B. Setting up of display fabrication units
- C. ATMP/OSAT assembly and testing units
- D. Fiscal incentives for chip design under the DLI Scheme
Q7. With reference to NITI Aayog's 'Future of India's Semiconductor Industry' roadmap, consider the following statements:
1. It targets building a USD 120-150 billion domestic semiconductor value chain by 2035.
2. It aims for India to capture 10-13% of the global semiconductor market share by 2035.
3. It advises India to compete primarily in cutting-edge, leading-edge fabrication rather than in mature nodes and packaging.
Which of the statements given above is/are correct?
- It targets building a USD 120-150 billion domestic semiconductor value chain by 2035.
- It aims for India to capture 10-13% of the global semiconductor market share by 2035.
- It advises India to compete primarily in cutting-edge, leading-edge fabrication rather than in mature nodes and packaging.
- A. 1 and 2 only
- B. 1 and 3 only
- C. 2 and 3 only
- D. 1, 2 and 3
Q8. The NITI Aayog semiconductor roadmap is structured around five strategic pillars. Consider the following:
1. Pioneering
2. Production
3. Partnership
4. Procurement
Which of the above is/are correctly identified as one of these five strategic pillars?
- Pioneering
- Production
- Partnership
- Procurement
- A. 1 and 2 only
- B. 1, 2 and 3
- C. 2, 3 and 4
- D. 1, 2, 3 and 4
Q9. India's first true wafer fabrication unit, being set up by Tata Electronics in partnership with Taiwan's PSMC, was approved under which one of the following?
- A. The Modified Scheme for setting up of Semiconductor Fabs under the India Semiconductor Mission
- B. The Design Linked Incentive (DLI) Scheme
- C. The Modified Special Incentive Package Scheme (M-SIPS)
- D. The Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS)
Q10. In the context of the semiconductor value chain and the India Semiconductor Mission, the acronym 'ATMP' stands for which one of the following?
- A. Assembly, Testing, Marking and Packaging
- B. Advanced Test and Materials Processing
- C. Automated Transistor Manufacturing Process
- D. Assembly, Tooling, Metrology and Photolithography
Q11. The United States' CHIPS and Science Act, 2022 allocated approximately how much specifically for the semiconductor sector?
- A. USD 52 billion
- B. USD 39 billion
- C. USD 10 billion
- D. USD 165 billion
Q12. Who currently heads the India Semiconductor Mission as its Chief Executive Officer (also serving as Additional Secretary, MeitY)?
- A. Amitesh Kumar Sinha
- B. Ashwini Vaishnaw
- C. S. Krishnan
- D. Abhishek Singh