UPSC Current Affairs 19 April 2026 — PIB

• Groundbreaking of India’s First Advanced 3D Semiconductor Packaging Unit in Odisha; Major Boost to AI, 5G and Defence Tech
• Raksha Mantri to undertake 3-day visit to Germany
• Where Heritage Meets Intelligence: Empowering Artisans through AI
• Updates on Key Sectors in View of Developments in West Asia
• Sustained Earning From Scrap and Improved Non-Fare Revenue Help Railways Improve Station Experience Without Increasing Passenger Fares
• Accelerating India’s High Value Crop Diversification