UPSC Prelims Practice Questions — Union Minister Shri Ashwini Vaishnaw launches 2 nm semiconductor chip in Qualcomm in Bengaluru

Q1. With reference to the India Semiconductor Mission (ISM) 2.0 as compared with the original Semicon India programme, consider the following statements: Which of the statements given above is/are correct?

  1. ISM 2.0 was announced in the Union Budget 2026-27 with an allocation of Rs 1,000 crore for the financial year 2026-27.
  2. Whereas the original programme centred on ecosystem creation, ISM 2.0 emphasises producing semiconductor equipment and materials in India and designing full-stack Indian semiconductor intellectual property.
  3. Unlike the original programme, ISM 2.0 has been placed under the administrative guidance of the Ministry of Heavy Industries instead of the Ministry of Electronics and Information Technology.
  • A. 1 only
  • B. 1 and 2 only
  • C. 2 and 3 only
  • D. 1, 2 and 3

Q2. Under the Design Linked Incentive (DLI) scheme of the Semicon India programme (2021), the Product Design Linked Incentive component provides which one of the following?

  • A. Reimbursement of up to 50% of eligible expenditure, subject to a ceiling of Rs 15 crore per application
  • B. An incentive of 4-6% of net sales, subject to a ceiling of Rs 30 crore
  • C. Fiscal support of 50% of capital expenditure for compound semiconductor units
  • D. A grant of 30% of eligible expenditure, subject to a ceiling of Rs 25 crore per application

Q3. The Semicon India programme (2021) was approved with a total outlay of Rs 76,000 crore. Which one of its four component schemes provides fiscal support of up to 50% of project cost specifically for setting up silicon-based (CMOS) semiconductor fabrication units?

  • A. Scheme for Setting up of Semiconductor Fabs
  • B. Design Linked Incentive (DLI) Scheme
  • C. Scheme for Compound Semiconductors / Silicon Photonics / Sensors / ATMP-OSAT
  • D. Scheme for Setting up of Display Fabs

Q4. Of the 10 projects approved under the Semicon India programme (with an envisaged investment of about Rs 1.6 lakh crore), how many are semiconductor fabrication (fab) units, as distinct from packaging units?

  • A. 2
  • B. 4
  • C. 8
  • D. 10

Q5. Approved semiconductor projects such as the Tata Electronics fab at Dholera and the Micron facility in Gujarat are implemented through which of the following bodies, which serves as the nodal agency for the programme?

  • A. India Semiconductor Mission (ISM), under the Ministry of Electronics and Information Technology
  • B. Department for Promotion of Industry and Internal Trade (DPIIT)
  • C. Ministry of Heavy Industries
  • D. Invest India, under the Ministry of Commerce and Industry

Q6. The 2 nm semiconductor chip unveiled in February 2026 at Qualcomm's Bengaluru facility was launched by the Union Minister who holds which combination of portfolios?

  • A. Electronics & IT; Railways; and Information & Broadcasting
  • B. Electronics & IT; Commerce & Industry; and Railways
  • C. Science & Technology; Electronics & IT; and Railways
  • D. Electronics & IT; Communications; and Information & Broadcasting

Q7. The Qualcomm 2 nm chip design announced in February 2026 was developed across the company's Indian engineering centres located in the following cities: Which of the above is/are correctly identified as a centre where the design work was carried out?

  1. Bengaluru
  2. Chennai
  3. Hyderabad
  4. Pune
  • A. 1 and 2 only
  • B. 2, 3 and 4
  • C. 1, 2 and 3
  • D. 1, 2, 3 and 4

Q8. Advanced logic nodes of the 2 nm class, such as the chip designed by Qualcomm in India, rely on which transistor architecture, adopted at the leading edge as the successor to the FinFET design?

  • A. Gate-All-Around (GAA) nanosheet field-effect transistor
  • B. Planar MOSFET
  • C. Bipolar junction transistor
  • D. Silicon-on-insulator diode

Q9. The India Semiconductor Mission (ISM) has been set up as an Independent Business Division, operating under the guidance of the Ministry of Electronics and Information Technology, within which of the following organisations?

  • A. Digital India Corporation
  • B. Software Technology Parks of India (STPI)
  • C. National Informatics Centre (NIC)
  • D. Centre for Development of Advanced Computing (C-DAC)

Q10. Among the projects approved under the Semicon India programme (with cumulative envisaged investment of about Rs 1.6 lakh crore), which one entails the single largest individual investment?

  • A. Tata Electronics semiconductor fab at Dholera, Gujarat (about Rs 91,526 crore)
  • B. Tata Electronics OSAT unit in Assam (about Rs 27,120 crore)
  • C. Micron facility in Gujarat (about Rs 22,516 crore)
  • D. CG Power OSAT unit at Sanand, Gujarat (about Rs 7,600 crore)

Q11. In the context of India's semiconductor drive, the term 'tape-out' — as in Qualcomm's 2 nm tape-out from its India centres — refers to which one of the following?

  • A. The finalisation of a chip's design and its release to a foundry for fabrication
  • B. The physical manufacturing of silicon wafers within a fabrication plant
  • C. The assembly, testing, marking and packaging (ATMP) of finished chips
  • D. The export of finished semiconductors to global markets