UPSC Prelims Practice Questions — PM to participate in groundbreaking ceremony of HCL–Foxconn Joint Venture project on 21 February

Q1. With reference to the India Semiconductor Mission (ISM), which one of the following most accurately describes it?

  • A. The nodal agency under the Ministry of Electronics and Information Technology for the seamless implementation of semiconductor and display manufacturing schemes
  • B. A statutory regulator under the Ministry of Commerce and Industry that licenses semiconductor fabrication units
  • C. An autonomous public sector undertaking under the Ministry of Heavy Industries set up to manufacture semiconductors
  • D. An inter-ministerial fund managed by NITI Aayog to promote electronics exports

Q2. Consider the following, in the context of India's semiconductor policy architecture: 1. Modified Scheme for setting up Semiconductor Fabs 2. Design Linked Incentive (DLI) Scheme 3. Modified Scheme for ATMP / OSAT facilities 4. Production Linked Incentive (PLI) Scheme for Large Scale Electronics Manufacturing Which of the above is/are correctly identified as schemes/components forming part of the Semicon India Programme?

  1. Modified Scheme for setting up Semiconductor Fabs
  2. Design Linked Incentive (DLI) Scheme
  3. Modified Scheme for ATMP / OSAT facilities
  4. Production Linked Incentive (PLI) Scheme for Large Scale Electronics Manufacturing
  • A. 1, 2 and 3
  • B. 2 and 4 only
  • C. 1 and 3 only
  • D. 1, 2, 3 and 4

Q3. Which one of the following was the first Assembly, Testing, Marking and Packaging (ATMP)-type semiconductor unit to be approved under the India Semiconductor Mission?

  • A. Micron Technology's unit at Sanand, Gujarat
  • B. CG Power's unit at Sanand, Gujarat
  • C. HCL–Foxconn's unit at YEIDA, Uttar Pradesh
  • D. Tata Electronics' unit in Assam

Q4. Under the Modified Programme for the development of semiconductors and display manufacturing, what quantum of fiscal support (as a percentage of capital expenditure, on a pari-passu basis) is available for setting up an ATMP / OSAT facility?

  • A. 25%
  • B. 40%
  • C. 50%
  • D. 75%

Q5. The HCL–Foxconn semiconductor joint venture at YEIDA received the approval of the Union Cabinet in which year, and under which framework?

  • A. 2023, under the Production Linked Incentive Scheme
  • B. 2025, under the India Semiconductor Mission
  • C. 2021, under Make in India 2.0
  • D. 2024, under the Modified Special Incentive Package Scheme (M-SIPS)

Q6. The HCL–Foxconn unit (India Chip Pvt. Ltd.) at YEIDA is designed for a monthly production capacity of how many wafers?

  • A. 5,000 wafers per month
  • B. 10,000 wafers per month
  • C. 20,000 wafers per month
  • D. 50,000 wafers per month

Q7. Consider the following statements comparing India's semiconductor projects: 1. The Vedanta–Foxconn joint venture was the first ISM-approved unit to begin production in India. 2. Micron's Sanand unit was the first semiconductor project approved under the India Semiconductor Mission, in 2023. 3. The HCL–Foxconn unit is located in Uttar Pradesh, whereas Micron's unit is located in Gujarat. Which of the statements given above is/are correct?

  1. The Vedanta–Foxconn joint venture was the first ISM-approved unit to begin production in India.
  2. Micron's Sanand unit was the first semiconductor project approved under the India Semiconductor Mission, in 2023.
  3. The HCL–Foxconn unit is located in Uttar Pradesh, whereas Micron's unit is located in Gujarat.
  • A. 1 only
  • B. 1 and 2 only
  • C. 2 and 3 only
  • D. 1, 2 and 3

Q8. The India Semiconductor Mission, which appraises and operationalises semiconductor units such as the HCL–Foxconn project, functions under which ministry?

  • A. Ministry of Commerce and Industry
  • B. Ministry of Heavy Industries
  • C. Ministry of Electronics and Information Technology
  • D. Ministry of Science and Technology

Q9. In the context of the HCL–Foxconn project, the acronym 'YEIDA' stands for which one of the following?

  • A. Yamuna Expressway Industrial Development Authority
  • B. Yamuna Electronics and Industrial Development Agency
  • C. Yamuna Estuary Industrial Development Area
  • D. Yamuna Enterprise and Investment Development Authority

Q10. For the HCL–Foxconn unit, the provision of land at YEIDA and associated single-window clearances is primarily the responsibility of which authority?

  • A. The Government of Uttar Pradesh acting through YEIDA
  • B. The India Semiconductor Mission acting alone, with no state role whatsoever
  • C. The Ministry of Electronics and Information Technology directly
  • D. Noida International Airport Limited

Q11. Consider the following statements about the semiconductor value chain and the HCL–Foxconn unit: 1. ATMP/OSAT constitutes the back-end (assembly, testing and packaging) segment, whereas fabrication is the front-end segment of the value chain. 2. The HCL–Foxconn unit at YEIDA is a wafer fabrication (front-end) facility. 3. The Display Driver ICs produced by the unit are mature-node, high-volume chips. Which of the statements given above is/are correct?

  1. ATMP/OSAT constitutes the back-end (assembly, testing and packaging) segment, whereas fabrication is the front-end segment of the value chain.
  2. The HCL–Foxconn unit at YEIDA is a wafer fabrication (front-end) facility.
  3. The Display Driver ICs produced by the unit are mature-node, high-volume chips.
  • A. 1 and 2 only
  • B. 1 and 3 only
  • C. 2 and 3 only
  • D. 1, 2 and 3