UPSC Prelims Practice Questions — Prime Minister Shri Narendra Modi participates in the groundbreaking ceremony of HCL-Foxconn Semiconductor Unit in Uttar Pradesh via Video Conferencing

Q1. The HCL-Foxconn joint-venture plant in Uttar Pradesh is which numbered semiconductor unit to be approved under the India Semiconductor Mission?

  • A. Fourth
  • B. Fifth
  • C. Sixth
  • D. Seventh

Q2. In which year did the Union Cabinet approve the HCL-Foxconn semiconductor unit in Uttar Pradesh?

  • A. 2023
  • B. 2024
  • C. 2025
  • D. 2026

Q3. With reference to the HCL-Foxconn semiconductor unit, consider the following statements. Which of the above is/are NOT correct?

  1. It is a joint venture between HCL of India and Foxconn of Taiwan.
  2. It will manufacture display driver chips.
  3. It entails an investment of about ₹3,700 crore.
  4. It is being set up at Dholera, Gujarat.
  • A. 1 only
  • B. 3 only
  • C. 4 only
  • D. 2 and 4

Q4. The HCL-Foxconn unit will produce 'display driver chips'. Which one of the following best describes a display driver integrated circuit?

  • A. A chip that regulates the power drawn by a device's battery
  • B. An integrated circuit that controls and drives the pixels of a display panel
  • C. A memory chip dedicated to storing graphics and image files
  • D. A processor that renders three-dimensional graphics for gaming

Q5. With reference to the location of the HCL-Foxconn project site, consider the following statements. Which of the above is/are NOT correct?

  1. It lies within the Yamuna Expressway Industrial Development Authority (YEIDA) region.
  2. It is located near the Noida International Airport at Jewar.
  3. It falls in the Gautam Buddh Nagar district of Uttar Pradesh.
  4. It is situated along the Ganga Expressway.
  • A. 4 only
  • B. 1 and 4
  • C. 3 only
  • D. 2 and 3

Q6. The HCL-Foxconn plant near Jewar is being developed within the industrial jurisdiction of which one of the following authorities?

  • A. Greater Noida Industrial Development Authority
  • B. New Okhla Industrial Development Authority (NOIDA)
  • C. Yamuna Expressway Industrial Development Authority (YEIDA)
  • D. Uttar Pradesh State Industrial Development Authority (UPSIDA)

Q7. Under the packaging vertical of the Semicon India Programme, the dicing of wafers into dies, their packaging and functional testing carried out as a third-party service for multiple client companies falls under which category of facility?

  • A. Wafer Fab
  • B. OSAT (Outsourced Semiconductor Assembly and Test)
  • C. Compound Semiconductor Fab
  • D. Display Fab

Q8. Foxconn, the Taiwanese partner in the joint venture, is most accurately described as which one of the following?

  • A. The world's largest semiconductor foundry
  • B. The world's largest electronics contract manufacturer
  • C. The world's largest smartphone brand by unit sales
  • D. The world's largest display panel manufacturer

Q9. With reference to the groundbreaking ceremony of the HCL-Foxconn semiconductor unit, which of the following are correctly identified?

  1. It was held on 21 February 2026.
  2. The Prime Minister participated in the ceremony via video conferencing.
  3. The unit for which the ground was broken is located in Uttar Pradesh.
  4. The Prime Minister physically inaugurated commercial production at the site.
  • A. 1, 2 and 3 only
  • B. 1 and 4 only
  • C. 2, 3 and 4 only
  • D. 1, 2, 3 and 4