UPSC Prelims Practice Questions — Groundbreaking of India’s First Advanced 3D Semiconductor Packaging Unit in Odisha; Major Boost to AI, 5G and Defence Tech
Q1. As of December 2025, how many semiconductor projects had been approved under the India Semiconductor Mission?
Q2. The four semiconductor units cleared by the Union Cabinet in August 2025 are together expected to generate skilled employment for exactly how many professionals?
- A. 2,034
- B. 4,600
- C. 13,000
- D. 76,000
Q3. With reference to the 3D Glass Solutions unit whose foundation stone was laid at Info Valley, Bhubaneswar, which of the following are correctly identified?
- It is a greenfield advanced packaging and embedded glass substrate ATMP facility.
- Its planned annual capacity includes about 70,000 glass panels.
- It involves a total investment of around ₹1,943 crore.
- It is India's first Silicon Carbide compound-semiconductor fabrication unit.
- A. 1, 2 and 3
- B. 1 and 4 only
- C. 2, 3 and 4
- D. 1, 2, 3 and 4
Q4. With reference to Odisha's emerging semiconductor ecosystem, which of the following are correctly identified?
- Odisha is the first Indian State to host both a compound-semiconductor fab and a 3D glass-substrate packaging unit.
- Both the SiCSem fab and the 3D Glass Solutions unit are located at Info Valley, Bhubaneswar.
- SiCSem is set to be India's first commercial compound-semiconductor fab.
- SiCSem's technology partner is a firm based in Taiwan.
- A. 1, 2 and 3
- B. 1 and 4 only
- C. 2, 3 and 4
- D. 1, 2, 3 and 4
Q5. Which one of the following is set to be India's first commercial compound-semiconductor fabrication unit?
- A. Micron unit at Sanand
- B. SiCSem unit at Info Valley, Bhubaneswar
- C. Tata–PSMC fab at Dholera
- D. CG Power unit at Sanand
Q6. The advanced packaging (ATMP) and fabrication units set up under the India Semiconductor Mission are formally approved for fiscal support by which one of the following authorities?
- A. The Reserve Bank of India
- B. The Securities and Exchange Board of India
- C. The Union Cabinet
- D. The NITI Aayog Governing Council
Q7. The 3D Glass Solutions Bhubaneswar unit, whose products serve AI, 5G/6G and defence electronics, is planned to produce annually approximately how many advanced 3D heterogeneous integration (3DHI) modules?
- A. 13,000
- B. 70,000
- C. 50,00,000
- D. 9,60,00,000
Q8. How many semiconductor units were approved by the Union Cabinet in the February 2024 wave of the India Semiconductor Mission?