·PIB·15 marks·250–350 words

Critically evaluate the evolution of India's semiconductor policy from the Semicon India Programme to ISM 2.0.

In this answer
  1. Achievements of the evolution
  2. Persisting weaknesses

India's chip policy has travelled from a ₹76,000 crore fiscal-support framework announced in 2021 [1] to ISM 2.0's focus on equipment, materials and indigenous design IP [2]. The journey shows genuine institutional learning, but capability still rests at the back end of the value chain.

Achievements of the evolution

  • Institutional autonomy: ISM was created as an Independent Business Division within Digital India Corporation, with administrative and financial autonomy — enabling faster approvals than a conventional ministry wing [1].
  • Capital mobilisation: 12 manufacturing units with cumulative investment over ₹1.64 lakh crore stand approved; Micron, Kaynes and CG Semi have begun commercial production [3].
  • Spatial diffusion: Cabinet clearance for units in Odisha, Punjab and Andhra Pradesh (₹4,600 crore) [4] widened the footprint beyond Gujarat, aiding balanced industrial growth.
  • Design ecosystem: The Design Linked Incentive Scheme (₹1,000 crore) has sanctioned 24 chip-design projects and given 95 firms access to industry-grade EDA tools [5].

Persisting weaknesses

  • Back-end concentration: Of the 12 approvals, nine are packaging (OSAT) units and only one is a silicon fab [3]. Assembly and testing capture far less technology and value than wafer fabrication.
  • Design uptake remains thin: DLI reimburses up to 50% of cost, capped at ₹15 crore, after expenditure [5] — a barrier for cash-poor MSMEs, the scheme's intended beneficiaries.
  • Upstream dependence: Lithography tools, ultra-pure chemicals and gases remain imported; self-reliance effectively stops at the factory gate.
  • Talent deficit: ISM 2.0's plan to widen support from 315 to 500 academic institutions [2] itself concedes that the manpower pipeline lags plant approvals.

ISM 2.0 is therefore a correctly diagnosed course-correction — targeting equipment and materials manufacturing, full-stack Indian IP and supply-chain resilience [2] — rather than a mere continuation. Its ₹1,000 crore FY 2026-27 provision [2] is, however, modest against the front-end outlay, making sustained funding and talent-building essential. If that depth is delivered, India's stated goal of meeting 70–75% of domestic chip needs by 2029 [3] can anchor genuine technological Atmanirbharta.

Sources

  1. 1India Semiconductor Mission — Semicon India Programme (PIB)₹76,000 crore outlay; ISM as Independent Business Division within Digital India Corporation
  2. 2India Semiconductor Mission 2.0 (PIB)ISM 2.0 focus areas; ₹1,000 crore FY 2026-27 provision; expansion from 315 to 500 academic institutions
  3. 3India Semiconductor Mission — progress update (PIB)12 approved units, ₹1.64 lakh crore, nine packaging units, units in commercial production, 70–75% domestic-application target by 2029
  4. 4Cabinet approves semiconductor manufacturing units in Odisha, Punjab and Andhra Pradesh with an outlay of ₹4,600 crore (PIB)geographic spread of approved units
  5. 5Design Linked Incentive (DLI) Scheme (PIB)₹1,000 crore outlay, 50% support capped at ₹15 crore per application, 24 chip-design projects, 95 firms with EDA tool access

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