Critically evaluate the evolution of India's semiconductor policy from the Semicon India Programme to ISM 2.0.
In this answer
India's chip policy has travelled from a ₹76,000 crore fiscal-support framework announced in 2021 [1] to ISM 2.0's focus on equipment, materials and indigenous design IP [2]. The journey shows genuine institutional learning, but capability still rests at the back end of the value chain.
Achievements of the evolution
- Institutional autonomy: ISM was created as an Independent Business Division within Digital India Corporation, with administrative and financial autonomy — enabling faster approvals than a conventional ministry wing [1].
- Capital mobilisation: 12 manufacturing units with cumulative investment over ₹1.64 lakh crore stand approved; Micron, Kaynes and CG Semi have begun commercial production [3].
- Spatial diffusion: Cabinet clearance for units in Odisha, Punjab and Andhra Pradesh (₹4,600 crore) [4] widened the footprint beyond Gujarat, aiding balanced industrial growth.
- Design ecosystem: The Design Linked Incentive Scheme (₹1,000 crore) has sanctioned 24 chip-design projects and given 95 firms access to industry-grade EDA tools [5].
Persisting weaknesses
- Back-end concentration: Of the 12 approvals, nine are packaging (OSAT) units and only one is a silicon fab [3]. Assembly and testing capture far less technology and value than wafer fabrication.
- Design uptake remains thin: DLI reimburses up to 50% of cost, capped at ₹15 crore, after expenditure [5] — a barrier for cash-poor MSMEs, the scheme's intended beneficiaries.
- Upstream dependence: Lithography tools, ultra-pure chemicals and gases remain imported; self-reliance effectively stops at the factory gate.
- Talent deficit: ISM 2.0's plan to widen support from 315 to 500 academic institutions [2] itself concedes that the manpower pipeline lags plant approvals.
ISM 2.0 is therefore a correctly diagnosed course-correction — targeting equipment and materials manufacturing, full-stack Indian IP and supply-chain resilience [2] — rather than a mere continuation. Its ₹1,000 crore FY 2026-27 provision [2] is, however, modest against the front-end outlay, making sustained funding and talent-building essential. If that depth is delivered, India's stated goal of meeting 70–75% of domestic chip needs by 2029 [3] can anchor genuine technological Atmanirbharta.
Sources
- 1India Semiconductor Mission — Semicon India Programme (PIB)₹76,000 crore outlay; ISM as Independent Business Division within Digital India Corporation
- 2India Semiconductor Mission 2.0 (PIB)ISM 2.0 focus areas; ₹1,000 crore FY 2026-27 provision; expansion from 315 to 500 academic institutions
- 3India Semiconductor Mission — progress update (PIB)12 approved units, ₹1.64 lakh crore, nine packaging units, units in commercial production, 70–75% domestic-application target by 2029
- 4Cabinet approves semiconductor manufacturing units in Odisha, Punjab and Andhra Pradesh with an outlay of ₹4,600 crore (PIB)geographic spread of approved units
- 5Design Linked Incentive (DLI) Scheme (PIB)₹1,000 crore outlay, 50% support capped at ₹15 crore per application, 24 chip-design projects, 95 firms with EDA tool access