·The Hindu·15 marks·250–350 wordsPolityEconomyS&T

Examine how India Semiconductor Mission 2.0 differs from its predecessor in approach, and assess whether the shift from fab-subsidy to design/talent focus is appropriate for India's comparative advantage.

In this answer
  1. How the approach differs
  2. Why the shift fits India's comparative advantage
  3. Where caution is needed

Launched in December 2021 with a ₹76,000 crore outlay and up to 50% capital subsidy for fabrication units, ISM 1.0 sought to seed a chip ecosystem where none existed [1]. ISM 2.0, notified by MeitY with an outlay of about ₹1.28 lakh crore, marks a shift from ecosystem creation to ecosystem consolidation and global integration [2][5].

How the approach differs

  • From fabs to the full value chain: ISM 2.0 works through six fungible pillars — design, machines & materials, fabs, packaging & testing, R&D and talent — instead of a fab-centric push [5].
  • Subsidy recalibration: central capital support for fabs is moderated to up to 40%, partly offset by additional State support, while R&D and talent projects get up to 75% [5].
  • From assembly to ownership: explicit focus on Indian/OCI-owned semiconductor IP and industry-led research and training centres for strategic-priority sectors [2][5].
  • Upstream deepening: domestic manufacture of equipment, chemicals and gases addresses the import bottleneck exposed under ISM 1.0 [2].

Why the shift fits India's comparative advantage

  • India's proven strength is design talent — a large share of global chip design engineering already happens here, and 24 design start-ups are supported under the design scheme [1].
  • ISM 1.0 has already delivered the hard part: 12 projects worth ~₹1.64 lakh crore, including India's first fab, compound fabs and nine packaging units, plus the first Made-in-India chips [3][4]. Anchor capacity exists; depth does not.
  • Design and packaging are capital-light, skill-intensive — better matched to India's factor endowment than leading-edge fabs.

Where caution is needed

  • A lower fab subsidy risks deterring investors amid aggressive incentives elsewhere.
  • Fungibility across pillars aids flexibility but weakens outcome tracking.
  • Design without fabrication depth leaves strategic dependence intact.

The shift is broadly appropriate: India should compete where it is strong while sustaining fab momentum. Firm Centre–State co-financing, transparent pillar-wise reporting, and friend-shoring partnerships can convert design leadership into genuine technological sovereignty.

Sources

  1. 1India Semiconductor Mission 2.0, PIBISM 1.0 launch (Dec 2021), ₹76,000 crore outlay, 50% fab subsidy; 24 supported design start-ups
  2. 2Budget 2026-27 announces the launch of India Semiconductor Mission (ISM) 2.0, PIBshift from ecosystem creation to consolidation; equipment/materials, full-stack Indian IP, industry-led research and training centres
  3. 3India Semiconductor Mission progress, PIB12 approved projects worth ~₹1.64 lakh crore: one fab, two compound fabs, nine packaging/testing units
  4. 4Prime Minister presented with first set of Made-in-India chips, PIBfirst indigenously produced chips
  5. 5Govt. notifies ₹1.3 lakh-crore semicon scheme's phase two, The HinduMeitY notification, ₹1.28 lakh crore outlay, six fungible pillars, 40% fab and 75% R&D/talent subsidy, Indian/OCI-owned IP focus
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