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Govt. notifies ₹1.3 lakh-crore semicon scheme’s phase two

In this note
  1. At a Glance
  2. Why in the News
  3. Background & Evolution
  4. Core Static Facts
  5. Multi-Dimensional Analysis
  6. Recent Developments (last 12-18 months)
  7. Prelims Hooks
  8. Mains Relevance
  9. Related Topics to Study Next
  10. Common Errors / Trap Areas
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1. At a Glance

  • India Semiconductor Mission 2.0 (ISM 2.0) notified by the Ministry of Electronics and Information Technology (MeitY), with an outlay of ₹1.28 lakh crore, targeting sops for electronics/semiconductor manufacturing. [1]
  • Marks a strategic shift from ecosystem creation (ISM 1.0) to ecosystem consolidation and global integration — design, equipment/materials, fabs, packaging/testing, R&D, and talent. [2]
  • High UPSC relevance: intersects Digital India, Atmanirbhar Bharat, strategic technology sovereignty, and GS-III (S&T, Economy).
  • Union Budget 2026-27 formally announced ISM 2.0's launch, with an initial FY27 provision of ₹1,000 crore. [3]

2. Why in the News

  • MeitY notified ISM 2.0 on/around 1 September 2026 (reported), with IT Minister Ashwini Vaishnaw addressing a press conference on the same. [S1, Article]
  • The notification operationalises the ISM 2.0 announcement made in the Union Budget 2026-27. [3]

3. Background & Evolution

  • ISM 1.0 launched in December 2021 with a ₹76,000 crore outlay, offering up to 50% capital subsidy to chip fabrication projects. [2]
  • As of June 2026, 12 projects worth ~₹1.64 lakh crore approved under ISM 1.0 — comprising one semiconductor fab, two compound semiconductor fabs, and nine packaging/testing (ATMP/OSAT) units. [4]
  • India also achieved a milestone with first Made-in-India chips presented to the Prime Minister. [5]
  • Budget 2026-27 announced ISM 2.0 as the successor phase, shifting focus toward design, equipment/materials, and talent — not just fab capacity. [3]
  • ISM 2.0 notified by MeitY, outlay ₹1.28 lakh crore, with all "pillars" fungible for investment allocation. [6]

4. Core Static Facts

Item Detail
Scheme India Semiconductor Mission 2.0 (ISM 2.0)
Nodal Ministry Ministry of Electronics and Information Technology (MeitY) [6]
Outlay ₹1.28 lakh crore (reported by article); ₹1,000 crore provisioned for FY 2026-27 in Budget [S3, Article]
Predecessor ISM 1.0 (Dec 2021), outlay ₹76,000 crore, 50% capital subsidy to fabs [2]
Fab subsidy under ISM 2.0 Capital subsidy cut from 50% (ISM 1.0) to up to 40% [6]
R&D subsidy Up to 75% of project cost [6]
Talent development subsidy Same extent as R&D (up to 75%) [6]
Six Pillars (1) Design (2) Machines & Materials (3) Fabs (4) Packaging & Testing (5) R&D (6) Talent Development [6]
Key feature Pillars are fungible — investment share across categories not fixed [6]
Minister Ashwini Vaishnaw, Union Minister for Electronics & IT [6]
Approvals under ISM (cumulative, June 2026) 12 projects worth ~₹1.64 lakh crore [4]

5. Multi-Dimensional Analysis

Economic

  • Aims to deepen domestic value addition across the semiconductor value chain (design to packaging), reducing import dependence on chips critical to electronics, auto, telecom, and defence sectors. [2]
  • Reduced fab subsidy (40% vs 50%) signals a maturing investment climate — India relying more on demonstrated global player interest and state co-funding rather than pure central sops. [6]

Scientific/Technological

  • Explicit push for Indian-owned or OCI-owned IP in chip design for "strategic priority" industries — ties to defence/security self-reliance in chips. [6]
  • Focus on capital equipment and chemicals/gases manufacturing addresses upstream supply-chain gaps (a major bottleneck flagged during ISM 1.0). [6]

Administrative/Governance

  • Federal cost-sharing model: Centre's reduced capital subsidy share partly offset by "additional support provided by States," indicating a Centre-State co-financing shift. [6]
  • Fungibility across the six pillars gives implementing agencies flexibility but could complicate outcome tracking/accountability.

Geopolitical/Strategic

  • Framed by Minister Vaishnaw around building global "dependence" on India's semiconductor supply chain — positions India within the China+1 / friend-shoring global semiconductor realignment. [6]

6. Recent Developments (last 12-18 months)

  • June 2026: PIB reports 12 ISM-approved projects worth ~₹1.64 lakh crore, including India's first semiconductor fab and compound semiconductor fabs. [4]
  • February 2026 (Budget 2026-27): Formal announcement of ISM 2.0 launch; ₹1,000 crore provisioned for FY27. [3]
  • ~September 2026: MeitY notifies ISM 2.0 with ₹1.28 lakh crore outlay and six-pillar structure. [6]

7. Prelims Hooks

  • ISM 2.0 notified by the Ministry of Electronics and Information Technology (MeitY), not the Ministry of Commerce. [6]
  • ISM 2.0 outlay: ₹1.28 lakh crore. [6]
  • ISM 1.0 was launched in December 2021 with outlay ₹76,000 crore. [2]
  • ISM 1.0 fab capital subsidy: 50%; ISM 2.0 fab capital subsidy: up to 40%. [6]
  • ISM 2.0 has six pillars: Design, Machines & Materials, Fabs, Packaging & Testing, R&D, Talent Development. [6]
  • R&D and Talent Development pillars receive subsidy of up to 75% of project cost. [6]
  • Union Budget 2026-27 formally announced ISM 2.0's launch. [3]
  • FY 2026-27 budgetary provision for ISM 2.0: ₹1,000 crore. [3]
  • As of June 2026, ISM has approved 12 projects worth ~₹1.64 lakh crore. [4]
  • These 12 projects include 1 semiconductor fab, 2 compound semiconductor fabs, and 9 packaging/testing units. [4]
  • Under ISM 2.0's design pillar, focus is on chips owned by Indians or OCIs in strategic-priority industries. [6]
  • All six pillars of ISM 2.0 are fungible in terms of investment share. [6]
  • ISM 2.0 press conference statement made by IT Minister Ashwini Vaishnaw. [6]

8. Mains Relevance

9. Related Topics to Study Next

  • Atmanirbhar Bharat Abhiyan — the broader self-reliance framework ISM sits within.
  • PLI (Production Linked Incentive) Schemes — parallel manufacturing-incentive architecture across sectors.
  • Digital India Programme — MeitY's umbrella digital ecosystem initiative.
  • China+1 strategy / global supply chain diversification — geopolitical backdrop driving chip investment into India.
  • Quad Semiconductor Supply Chain Initiative — international cooperation angle relevant to strategic tech.
  • National Quantum Mission / DRDO chip programmes — allied strategic-technology missions with overlapping talent/R&D goals.
  • Union Budget 2026-27 key allocations — fiscal policy context for ISM 2.0's provisioning.

10. Common Errors / Trap Areas

  • Confusing ISM 1.0's 50% fab subsidy with ISM 2.0's 40% — aspirants often assume subsidies increased in the newer phase; they were actually reduced.
  • Misattributing the scheme to the Ministry of Commerce and Industry or DPIIT instead of the correct MeitY.
  • Confusing the ₹1.28 lakh crore total outlay (long-term) with the ₹1,000 crore FY27 budgetary provision (annual) — these are different figures for different purposes.
  • Mixing up ISM (India Semiconductor Mission) with the broader PLI Scheme for electronics — they are related but distinct instruments.
  • Assuming all six pillars have fixed individual allocations — they are explicitly fungible.

Sources

  1. 1India Semiconductor Mission 2.0pib.gov.in · tier 1
  2. 2India Semiconductor Mission 2.0 (PDF)static.pib.gov.in · tier 1
  3. 3Budget 2026-27 announces the launch of India Semiconductor Mission (ISM) 2.0pib.gov.in · tier 1
  4. 4Under India Semiconductor Mission 2.0, target is to expand...pib.gov.in · tier 1
  5. 5Prime Minister presented with First set of Made-in-India Chipspib.gov.in · tier 1
  6. 6Govt. notifies ₹1.3 lakh-crore semicon scheme's phase two — The Hinduthehindu.com · tier 4
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